-
Martin Bergmann, Gernot Bohmann, Harald Grundl, Steve Keilhauer, Vlad Zila
"Tilt and swivel chair and mechanism therefor"
, CA 2488519 A1 May 25, 2006
-
Martin Bergmann, Gernot Bohmann, Harald Grundl, Steve Keilhauer, Vlad Zila
"Tilt and swivel chair and mechanism therefor"
, US 7547067 B2 Jun 16, 2009
-
Martin Bergmann, Gernot Bohmann, Harald Grundl, Steve Keilhauer, Vlad Zila
"Tilt and swivel chair and mechanism therefor"
, EP1827173 A1 Sep 5, 2007
-
Kyle Hanson, Mark Dix, Vlad Zila, Daniel J. Woodruff
"Semiconductor processing apparatus having lift and tilt mechanism"
, US 7002698 B2 May 25, 2006
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Kyle Hanson, Mark Dix, Vlad Zila, Daniel J. Woodruff
"Semiconductor processing apparatus having lift and tilt mechanism"
, US 20020009357 A1 Jan 24, 2002
-
Kyle Hanson, Mark Dix, Vlad Zila, Daniel J. Woodruff
"Semiconductor processing apparatus having lift and tilt mechanism"
, US 20040226510 A1 Nov 18, 2004
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Kyle Hanson, Mark Dix, Vlad Zila, Daniel J. Woodruff
"Semiconductor processing apparatus having lift and tilt mechanism"
, US6091498 A Jul 18, 2000
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Kyle Hanson, Mark Dix, Vlad Zila, Daniel J. Woodruff
"Semiconductor processing apparatus having lift and tilt mechanism"
, US 6654122 B1 Nov 25, 2003
-
Mark Dix, Kyle Hanson, Daniel J Woodruff, Vlad Zila
"Semiconductor processing apparatus having wafer re-orientation mechanism"
, WO 1999016689 A1 Apr 8, 1999
-
Mark Dix, Kyle Hanson, Daniel J Woodruff, Vlad Zila
"Semiconductor processing apparatus having wafer re-orientation mechanism"
, EP 1034123 A1 Sep 13, 2000
-
Robert W. Berner, Daniel J. Woodruff, Vladimir Zila
"Processing head for semiconductor processing machines"
, US 5731678 A Mar 24, 1998
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Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, LinLin Chen, John M. Pedersen, Vladimir Zila
"Apparatus for processing the surface of a microelectronic workpiece"
, US6303010 B1 Oct 16, 2001
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Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, LinLin Chen, John M. Pedersen, Vladimir Zila
"Methods and apparatus for processing the surface of a microelectronic workpiece"
, US 6309524 B1 Oct 30, 2001
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Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, LinLin Chen, John M. Pedersen, Vladimir Zila
"Methods and apparatus for processing the surface of a microelectronic workpiece"
, US 6869510 B2 Mar 22, 2005
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Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, LinLin Chen, John M. Pedersen, Vladimir Zila
"Methods and apparatus for processing the surface of a microelectronic workpiece"
, US 6309520 B1 Oct 30, 2001
-
Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, LinLin Chen, John M. Pedersen, Vladimir Zila
"Methods and apparatus for processing the surface of a microelectronic workpiece"
, US 6645356 B1 Nov 11, 2003
-
Robert W Berner, Daniel J Woodruff, Wayne J Schmidt, Kevin W Coyle, Vladimir Zila, Worm Lund
"Modular semiconductor workpiece processing tool"
, WO 1998002911 A1 Jan 22, 1998
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Robert W Berner, Daniel J Woodruff, Wayne J Schmidt, Kevin W Coyle, Vladimir Zila, Worm Lund
"Modular semiconductor workpiece processing tool"
, EP 0912994 A1 May 6, 1999
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Robert W Berner, Daniel J Woodruff, Wayne J Schmidt, Kevin W Coyle, Vladimir Zila, Worm Lund
"Modular semiconductor workpiece processing tool"
, US 7074246 B2 Jul 11, 2006
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Robert W Berner, Daniel J Woodruff, Wayne J Schmidt, Kevin W Coyle, Vladimir Zila, Worm Lund
"Modular semiconductor workpiece processing tool"
, US 20050193537 A1 Sep 8, 2005
-
Robert W Berner, Daniel J Woodruff, Wayne J Schmidt, Kevin W Coyle, Vladimir Zila, Worm Lund
"Modular semiconductor workpiece processing tool"
, US 6440178 B2 Aug 27, 2002
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Robert W Berner, Daniel J Woodruff, Wayne J Schmidt, Kevin W Coyle, Vladimir Zila, Worm Lund
"Modular semiconductor workpiece processing tool"
, US 6203582 B1 Mar 20, 2001
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Linlin Chen, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Daniel J. Woodruff, Vladimir Zila
"Method and apparatus for copper plating using electroless plating and electroplating"
, EP 1099012 A1 May 16, 2001
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Linlin Chen, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Daniel J. Woodruff, Vladimir Zila
"Method and apparatus for copper plating using electroless plating and electroplating"
, WO 2000003072 A1 Jan 20, 2000
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Linlin Chen, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Daniel J. Woodruff, Vladimir Zila
"Method and apparatus for copper plating using electroless plating and electroplating"
, US 20050189213 A1 Sep 1, 2005